timtel phase change thermal interface material product line



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Thermal Management Materials
UltraPhase 60

The latest generation of dieletric phase change thermal management technology, UltraPhase 60 utilizes the improved Kapton MT+ (plus) thermally conductive polyimide film substrate leading to signfinicant overall improvement in thermal performance compared to traditional MT polyimide films.


Free standing 45C phase change thermal film available in 4 mil, 8 mil and 12 mil film thicknesses die cut within it's proprietary die cut frame application surface pad transfer system. One side metal foil substrate options available.

SILTEL Thermally Conductive Silicone Film and Gap Pad Materials

Electrically insulating thermally conductive silicone film and gap filler pad materials available in a range of material thicknesses and thermal conductivity performance choices.



Thermally Conductive Non-Dielectric Phase Change Materials that utilizes a range of aluminum foil thicknesses and available with 60oC Phase Change Temperature coating of ActaPhase compound at various thicknesses on both sides.


Thermally Conductive Dielectric Phase Change Material with a 60oC phase change temperature that utilizes a range of Kapton MT thermally conductive polyimide films coated with the DiaPhase compound at various thicknesses on both sides.


Graphite Filled Thermally Conductive Non-Dielectric Phase Change Material that utilizes a range of aluminum foil thicknesses with a 60oC Phase Change Temperature coating of the IntraPhase compound at various thicknesses on both sides. Also available as a free standing film (no substrate).


Thermally Conductive Dielectric Phase Change Material with a 60oC phase change temperature that utilizes a quality series of thermally conductive polyimide films with the EcoPhase compound at various thicknesses on both sides.  This delivers quality thermal performance for more economically sensitive applications requiring quality thermal transfer.


Electrically Conductive Non-Dielectric Phase Change Thermal Interface Material that utilizes a range of aluminum foil thicknesses and compound coating of the SilverPhase compound at various thicknesses on both sides.