thermal management materials




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Comprehensive Thermal Management Material Solutions


electrically insulating thermally conductive silicone gap pad
Available standard as an 8 mil (0.20mm), 12 mil (0.30mm) and 18 mil (0.45mm) thick pad



  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
  • Thermal Conductivity: 2.0 W/m-K
  • High Performance Insulating Thermal Pad
  • Conformable with Excellent Surface Contact within a Range of Pressures
  • 3 Standard Thicknesses - Optional Pressure Sensitive Adhesive Backing
  • Flexible Demand - low volume to high volume requirements

Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements


SILTEL SF-TC2.0 Thermal Management Silicone Pad

SILTEL SF-TC2.0 is an electrically insulating fiberglass reinforced silicone film pad designed for optimized thermal performance between an electronic package and heat sink.  A reliable thermal conductivity is achieved through the use of thermally conductive ceramic particles filled to a specific formulation to achieve a reduction of thermal resistance during compression as well as provide excellent handling characteristics during installation.


With its fiberglass reinforced structure, SF-TC2.0 offers great mechanical stability and high cut-through resistance.

Typical Device Applications

  • MOSFET or IBGT's
  • Power Diodes
  • AC/DC Converters
  • Power Modules
  • Motor or Power Control Units
  • TO-218, TO-220, TO-247, TO-264, etc. component packages
  • Custom Power Applications
Material Delivery Formats 

  • Master Rolls
  • Slit Rolls
  • Sheets
  • Die Cut Indviduals
  • Multiple Die Cuts per Card
  • Die Cut Continuous Reels

Thermal Conductivity

  • 2.0 W/m-K

Thermal Impedance
(ASTM D5470)

8 mil (0.20mm)
0.610 oC in2 / Watt @ 30 PSI
0.310 oC in2 / Watt @ 150 PSI

12 mil (0.30mm)
0.740 oC in2 / Watt @ 30 PSI
0.450 oC in2 / Watt @ 150 PSI

18 mil (0.45mm)
0.960 oC in2 / Watt @ 30 PSI
0.630 oC in2 / Watt @ 150 PSI

Download data sheet above for additional properties
Standard Thicknesses

  • SF.20-TC2.0 (0.008" / 0.20mm)
  • SF.30-TC2.0 (0.012" / 0.30mm)
  • SF.45-TC2.0 (0.018" / 0.45mm)

Color:  Dark Brown
Standard Material Construction

  • Fiberglass Reinforced Structure

Optional silicone pressure sensitive adhesive backing available (Material Code: SIL1)

Contact us for custom SF-TC2.0 materials that exceed 18 mils (0.45mm)