phase change thermal interface materials



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Comprehensive Thermal Management Material Solutions

thermal interface material for power modules and heat sinks
Available standard as a 5 mil (0.13mm), 8 mil (0.20mm) or 12 mil (0.30mm) phase change film



  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements

  • 45oC phase change temperature
  • Non-Silicone Phase Change Compound Design
  • Easy to Handle and Install - Die Cut Release Liner System
  • Multiple Film Thicknesses (0.005", 0.008", 0.012") - Custom Film Thicknesses Available
  • Available in rolls, sheets or die cuts
  • Flexible Demand - low volume to high volume requirements

phase change thermal film for device cooling - Xophase 45

XoPhase 45 is a free standing 45C phase change thermal film offering high performance heat transfer and device reliability.   XoPhase 45's unique formulation not only allows for surface conformability during initial phase change but also offers a soft interface pad solution within a film format that provides a reduction in the interface bond line (thickness) leading to high performance thermal transfer within large or small device footprints.



XoPhase 45 is manufactured standard in 4 mil, 8 mil and 12 mil free standing film thicknesses.  The ability to manufacture XoPhase 45 in a variety of film thicknesses as well as in a one sided substrate coating option allows us to meet a wide range of device applications across various markets.
Typical Device Applications

  • LED (light emitting diode)
  • Clip Mount / Heat Sinks
  • Microprocessor (CPU)
  • Memory Modules / Heat Sinks
  • Thermoelectric Modules
  • Ultra-Flat Interface Surfaces
  • Transistor / Diode
Other Information

  • RoHs Compliant
  • REACH Compliant
  • Halogen Free Compliant
Thermal Compound Film

  • 45oC Phase-Change Temperature
  • Thermal Conductivity ~ 3.0 W/m-K
  • Thermal Impedance - download the technical data sheet above for values.
Available Material Formats 

  • Die Cuts
  • Log Roll (with original coated liners)
  • Sheets:  (with original coated liners)

Note: bulk log roll and sheet stock will have clear release liner on both sides of thermal film.
Standard Film Thickness

  • X45-5 = 0.005" (0.13mm)
  • X45-8 = 0.008" (0.20mm)
  • X45-12 = 0.012" (0.30mm)
Substrate Coating Option

  • Aluminum Foil (multiple thicknesses) - coated 1 side
  • Copper Foil (multiple thicknesses)
  • Stainless Steel (multiple thicknesses) - coated 1 side

Contact us for more information regarding specifics with a one side XoPhase 45 substrate coating option.